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Impact of self-heating on the statistical variability in bulk and SOI FinFETs

机译:自加热对体积和sOI FinFET的统计变化的影响

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摘要

In this paper for the first time we study the impact\udof self-heating on the statistical variability of bulk and SOI\udFinFETs designed to meet the requirements of the 14/16nm\udtechnology node. The simulations are performed using the GSS\ud‘atomistic’ simulator GARAND using an enhanced\udelectro-thermal model that takes into account the impact of the\udfin geometry on the thermal conductivity. In the simulations we\udhave compared the statistical variability obtained from full-scale\udelectro-thermal simulations with the variability at uniform room\udtemperature and at the maximum or average temperatures\udobtained in the electro-thermal simulations. The combined effects\udof line edge roughness and metal gate granularity are taken into\udaccount. The distributions and the correlations between key\udfigures of merit including the threshold voltage, on-current,\udsubthreshold slope and leakage current are presented and\udanalysed.
机译:在本文中,我们首次研究了自发热对本体和SOI \ udFinFET的统计变异性的影响,这些FET设计为满足14 / 16nm \ udtechnology节点的要求。使用GSS \ ud“原子”模拟器GARAND使用增强的“ udud-热-热”模型进行仿真,该模型考虑了“ udfin”几何形状对导热系数的影响。在模拟中,我们已经比较了从全尺寸\电热模拟获得的统计变异性与在统一的室温\室温和最高或平均温度\电热模拟中获得的变异性。 \线边缘粗糙度和金属浇口粒度的综合影响已被考虑。给出并分析了关键的品质因数,包括阈值电压,导通电流,\亚阈值斜率和泄漏电流的分布及其相关性。

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